Industrial 8051

All ICs are RoHS compliant.

* Status: P - mass production, S - samples, UD - under development, N - not recommended for new design.

Chip	Description	Application Flash	SRAM	Data Flash	Loader Flash	Programm. methods	Clock   frequency	Supply   voltage   [V]	Operating temperature [°C]	Package	Status *
MS51BA9AE (1201 KB)	1T per machine cycle application Flash memory programmed in IAP mode 3 internal RC oscillators on-the-fly clock source switch via software up to 8 GPIO pins 6 x 16-bit PWM outputs 4 x 16-bit timers/counters Watchdog Wake-up timer 2 x UART, I2C, SPI interfaces 4 x 12-bit ADC (up to 500 ksps) LDO 4-level BOD (Brown-out detection) interrupt and reset and POR (Power-on reset) temperature range: industrial	8 KB	1 KB	configurable	4 KB	IAP	Ext. crystal: - Int. RC: 16 MHz (1 %) 24 MHz (1 %) 10 kHz	2.4 – 5.5	-40 – +105	MSOP-10	P
MS51DA9AE (1201 KB)	1T per machine cycle application Flash memory programmed in IAP mode 3 internal RC oscillators on-the-fly clock source switch via software up to 12 GPIO pins 6 x 16-bit PWM outputs 4 x 16-bit timers/counters Watchdog Wake-up timer 2 x UART, I2C, SPI interfaces 5 x 12-bit ADC (up to 500 ksps) LDO 4-level BOD (Brown-out detection) interrupt and reset and POR (Power-on reset) temperature range: industrial	8 KB	1 KB	configurable	4 KB	IAP	Ext. crystal: - Int. RC: 16 MHz (1 %) 24 MHz (1 %) 10 kHz	2.4 – 5.5	-40 – +105	TSSOP-14	P
MS51EC0AE (1497 KB)	1T per machine cycle application Flash memory programmed in IAP mode external crystal oscillators and 3 internal RC oscillators on-the-fly clock source switch via software up to 26 GPIO pins 12 x 16-bit PWM outputs 4 x 16-bit timers/counters Watchdog Wake-up timer 2 x UART, I2C, SPI interfaces 15 x 12-bit ADC (up to 500 ksps) LDO 4-level BOD (Brown-out detection) interrupt and reset and POR (Power-on reset) temperature range: industrial	32 KB	2 KB	configurable	4 KB	IAP	Ext. crystal: 24 MHz Int. RC: 16 MHz (1 %) 24 MHz (1 %) 10 kHz	2.4 – 5.5	-40 – +105	TSSOP-28	P
MS51FB9AE (1225 KB)	1T per machine cycle application Flash memory programmed in IAP mode 3 internal RC oscillators on-the-fly clock source switch via software up to 18 GPIO pins 6 x 16-bit PWM outputs 4 x 16-bit timers/counters Watchdog Wake-up timer 2 x UART, I2C, SPI interfaces 8 x 12-bit ADC (up to 500 ksps) LDO 4-level BOD (Brown-out detection) interrupt and reset and POR (Power-on reset) temperature range: industrial	16 KB	1 KB	configurable	4 KB	IAP	Ext. crystal: - Int. RC: 16 MHz (1 %) 24 MHz (1 %) 10 kHz	2.4 – 5.5	-40 – +105	TSSOP-20	P
MS51FC0AE	1T per machine cycle application Flash memory programmed in IAP mode external crystal oscillators and 3 internal RC oscillators on-the-fly clock source switch via software up to 18 GPIO pins 10 x 16-bit PWM outputs 4 x 16-bit timers/counters Watchdog Wake-up timer 2 x UART, I2C, SPI interfaces 10 x 12-bit ADC (up to 500 ksps) LDO 4-level BOD (Brown-out detection) interrupt and reset and POR (Power-on reset) temperature range: industrial	32 KB	2 KB	configurable	4 KB	IAP	Ext. crystal: 24 MHz Int. RC: 16 MHz (1 %) 24 MHz (1 %) 10 kHz	2.4 – 5.5	-40 – +105	TSSOP-20	P
MS51PC0AE (1497 KB)	1T per machine cycle application Flash memory programmed in IAP mode external crystal oscillators and 3 internal RC oscillators on-the-fly clock source switch via software up to 30 GPIO pins 12 x 16-bit PWM outputs 4 x 16-bit timers/counters Watchdog Wake-up timer 2 x UART, I2C, SPI interfaces 15 x 12-bit ADC (up to 500 ksps) LDO 4-level BOD (Brown-out detection) interrupt and reset and POR (Power-on reset) temperature range: industrial	32 KB	2 KB	configurable	4 KB	IAP	Ext. crystal: 24 MHz Int. RC: 16 MHz (1 %) 24 MHz (1 %) 10 kHz	2.4 – 5.5	-40 – +105	LQFP-32	P
MS51TC0AE (1497 KB)	1T per machine cycle application Flash memory programmed in IAP mode external crystal oscillators and 3 internal RC oscillators on-the-fly clock source switch via software up to 30 GPIO pins 12 x 16-bit PWM outputs 4 x 16-bit timers/counters Watchdog Wake-up timer 2 x UART, I2C, SPI interfaces 15 x 12-bit ADC (up to 500 ksps) LDO 4-level BOD (Brown-out detection) interrupt and reset and POR (Power-on reset) temperature range: industrial	32 KB	2 KB	configurable	4 KB	IAP	Ext. crystal: 24 MHz Int. RC: 16 MHz (1 %) 24 MHz (1 %) 10 kHz	2.4 – 5.5	-40 – +105	QFN-33	P
MS51XB9AE (1225 KB)	1T per machine cycle application Flash memory programmed in IAP mode external crystal oscillators and 3 internal RC oscillators on-the-fly clock source switch via software up to 18 GPIO pins 6 x 16-bit PWM outputs 4 x 16-bit timers/counters Watchdog Wake-up timer 2 x UART, I2C, SPI interfaces 8 x 12-bit ADC (up to 500 ksps) LDO 4-level BOD (Brown-out detection) interrupt and reset and POR (Power-on reset) temperature range: industrial	16 KB	1 KB	configurable	4 KB	IAP	Ext. crystal: - Int. RC: 16 MHz (1 %) 24 MHz (1 %) 10 kHz	2.4 – 5.5	-40 – +105	QFN-20	P
MS51XC0AE (1497 KB)	1T per machine cycle application Flash memory programmed in IAP mode external crystal oscillators and 3 internal RC oscillators on-the-fly clock source switch via software up to 18 GPIO pins 10 x 16-bit PWM outputs 4 x 16-bit timers/counters Watchdog Wake-up timer 2 x UART, I2C, SPI interfaces 10 x 12-bit ADC (up to 500 ksps) LDO 4-level BOD (Brown-out detection) interrupt and reset and POR (Power-on reset) temperature range: industrial	32 KB	2 KB	configurable	4 KB	IAP	Ext. crystal: 24 MHz Int. RC: 16 MHz (1 %) 24 MHz (1 %) 10 kHz	2.4 – 5.5	-40 – +105	QFN-20	P